Ipc 2222 pdf
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users of this standard are encouraged to participate in the development of future revisions. 2 documentation hierarchy this standard identifies the generic physical design principles, and is supplemented by various sectional documents that provide details and sharper focus on specific aspects of printed board technol- ogy. hierarchy of ipc design specifications. ipc- 2222- pdf sectional design standard for rigid organic printed boards. design guide for the packaging of high speed electronic circuits. sectional design standard for rigid organic printed boards. ipc- 2222b used in conjunction with ipc- 2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. key concepts in ipc- 2222b are rigid laminate properties. others also bought. used in conjunction with ipc- 2221, ipc- 2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. ipc- 2221a generic standard on printed board design developed by the ipc- 2221 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions. developed by the ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions. contact: ipc supersedes: ipc- 2222a - december ipcfebruary 1998 ipc- d- 275 - september 1991 ® this is a preview of ipc 2222b- . 2) used in the manufacture of hdi printed boards. 1 目的 本标准包含的要求旨在建立有机印制板的专用设计细节， 应当与ipc- 2221结合使用， 以形成用于 贴装和连接元器件的设计。. this sec- tional standard, used in conjunction with ipc- 2221, supersedes ipc- d- 249. 6 ipc- sm- 782 surface mount design and land pattern standard ipc- pdf 2221 generic standard on printed board design ipc- 2222 ipc- 2223 ipc- 4101 specification for base materials for rigid and multilayer printed boards. benefits of flex due to the thin films used in flexible circuitry, flex can save weight and space and conform to three- dimensional configura- tions. generic performance specification for printed boards. dance with ipc- 2222 for rigid and ipc- 2223 for flexible core interconnections. ipc- 2222b sectional design standard for rigid organic printed boards developed by the ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions. ipc- am- 361 specification for rigid substrates for additive process boards ipc- tm- 650 test methods manual method 2. contact: 2215 sanders road northbrook, ilinoistel 847 509. qualification and performance specification for flexible printed boards. ( 2220 series) 1рс- 2222 rigid 1pc- 2223 flex 1рс- 2221 generic design. the ipc invites input on the effectiveness of the documentation and encourages user response through completion of ‘ ‘ suggestions for improvement’ ’ forms located at the end of each document. 1 institute for interconnecting and packaging elec- tronic circuits ( ipc) 1. developed by the ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc. this standard applies to single- sided, double- sided or multi- layered boards. examples are: ipc- 2222 ipc- 2223 ipc- 2224. contact: ipc 2215 sanders road northbrook, ilinoistel 847 509. ipc- eg- 140 specification for finished fabric woven. the ipc- 2222b standard applies to single- sided, double- sided, or multi- layered boards. exist between ipc- 2222 and those listed below, ipc- 2222 pdf takes precedence. ipc- 2222 sectional design standard for rigid organic printed boards developed by the ipc- d- 275 task group ( 0- 31b) of the rigid printed board committee ( d- 30) of ipc ansi users of this standard are encouraged to panicipate in the development of future revisions. 1 institute for interconnecting and packaging elec- ipc 2222 pdf tronic circuits ( ipc) ipc 2222 pdf 1 ipc- eg- 140 specification for finished fabric woven from ‘ ‘ e’ ’ glass for printed board. from ‘ ‘ e’ ’ glass for printed board. this standard establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. hierarchy of ipc design specifications ( 2220 series) ipc- 2222 rigid ipc- 2223 flex ipc- 2224 pcmcia ipc- 2225 mcm- l ipc- 2226 hdis ipc- 2227 discrete. users of this publication are encouraged to participate in the development of future revisions. the revision of the document in effect at the time of solici- tation shall take precedence. contact: ipc 2215 sanders road northbrook, illinoistel 847 509. key concepts in this document are: rigid laminate. publication date. developedby the ipc- 2221/ 2222 task group( d- 31b) of the rigid printedboardcommittee( d- 30) of ipc usersof this publicationare encouragedto participatein the developmentof futurerevisions. the information contained herein is intended to supplement generic design requirements identified in ipc- 2221. the documents are a part. takes precedence. 2 hdi types the design designation system of this standard recognizes the six industry approved design types ( see 5. ipc- 2222a sectional design standard for rigid organic printed boards developed by the ipc- 2221/ 2222 task group ( d- 31b) of the rigid printed board committee ( d- 30) of ipc users of this publication are encouraged to participate in the development of future revisions. ipc- 2222 rigid organic printed board structure design ipc- 2223 flexible printed board structure design ipc- 2225 organic, mcm- l, printed board structure design ipc- 2226 high density interconnect ( hdi) structure design the list is a partial summary and is not inherently a part of this generic standard. for passive or constraining core boards the materials shall be in accordance with ipc- 2221. exist between ipc- 2222 and those listed below, ipc- 2222. 年12月 ipc- 2222a- cn 1 刚性有机印制板设计分标准 1范围 本标准建立了刚性有机印制板设计的专用要求。 1.