Lv214 pdf
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6 and uscar 21 / rev. microspacetm will be available in single ( side- to- side or staggered) and double row versions, with top and side latch configuration. 680kg acceleration: frequency range: max. read this white paper to learn more about how this standard can help make crimp force monitoring more efficient. the following table shows which variants meet the re- quirements of lv214- 2 / slow- motion test, uscar- 2 / rev. mavt – multi- axial vibration testing. standards and specifications from various organizations provide a guideline from which manufacturers can measure different areas of quality, while also providing the end- user with the reassurance they are purchasing a trustworthy, long- lasting product. 2 damp heat, constant din en. 1 for different contact size and conductor cross section acc. lv214, in europe and uscar2, in north america. gateway can, lin, flex, power, gnd and buffer interfaces ethernet ( 100mbps). it goes without saying that every manufacturer wants to ensure they are producing a quality product. 1] number of test sample・ ・ ・ each part n= 5. lv 214- 4 is an automotive standard that was developed by representatives of the german car manufacturers audi ag, bmw ag, daimler ag, porsche ag and volkswagen ag. crimp parameters are at the nominal values as specified by the manufacturer. in a good crimp, the conductor crimp is filled with all wire strands, while the insulation crimp contains all the undamaged insulation material ( photos b and d). 2) continuous contact resistance [ lv214 e14. 1 aging in dry heat din en* vde, test b l 20. microspacetm crimp- to- wire connector platform’ s unique design enables lv214 severity- 2 and performs at 1. adhered to ieee 802. design and construction / entwurf und konstruktion. dry heat 120h pdf / 140° c lv214 b 20. the lv214 standard has been superseded by te testing standard. page 6 vw 75174: tg load type reference l 20. microspacetm will be available in single and double row versions, with top and side latch configurations. 3 inspection of as- received condition [ lv214 pg 0] ( 1) visual inspection [ e 0. simplification of the spec. 3 climatic cold climatic cold 48h / - 40° c plugging / unmating possible at - 20° c lv214 b 20. this specification is applicable to the termination characteristics of the microspacetm family of products which provides a unique design enables lv214 severity- 2 and performs at 1. 1 dry heat dry heat 48h / 80° c lv214 b6. please note, prototype parts or pre- serial parts can be differing slightly in dimensioning, form- and position tolerances to the interface drawings. 15 contact resistance continuous during dynamic load, broad- band random. 1 drop test after aging not performed lv215- 2 din enpg 21. the microspace™ families of products are available in staggered. vehicle connectors test specification lv214 ( edition march ) given in paragraph 3. the minitek microspace ™ has an operating temperature of 130̊ c which makes it suitable to be even used inside an engine. – removed test sequence table ( redundant with, redundant test requirements withhave been removed, removed german language. the impact of lv lv214 pdf 214- 4 – the german automotive oem lv214 pdf connector test specification by rob boyd, senior product manager, schleuniger, inc. update of the spec. te connectivity solutions for miniaturized automotive connectivity nanomqs miniaturized interconnection system based on the mqs terminals design, the nanomqs interconnection system was launched to address manufacturers’ need to miniaturize electronic components. the automotive lv 214- 4 standard provides guidance on terminal requirements for crimp force monitoring. an empty crimp has a full insulation crimp, but the conductor. to be in conformity with the. lv 214- 4 defines what an pdf empty crimp is. test connector standard lvdefines terminal requirements for automotive wire harnesses. alliance, uscar, lv214, iso 8092, kojiri, and sae j 2223 • solutions enable signaling technologies like lvds and ethernet • leader in pdf automotive ethernet and committed to open alliance tc2 / tc9 with 100 base- t1 ( 100 mbps) and 1000 base- t1 ( 1 gbps). 00mm ffc/ fpc connectors with autolock mechanism ideal for automotive and robotic operations are lv214 s1 qualified. 27mm ( staggered) pitch. test method・ ・ ・ monitor voltage drop during the test. the gateway control module ( gateway), similar to a car’ s centralized router, provides secure and reliable interconnections across multiple local area networks within a vehicle, enabling connected interactions between functional devices that share data. 3 bp/ bw and broadr- reach™. amphenol icc’ s minitek microspace ™ crimp- to- wire connector platform' s unique design enables lv214 severity- 2 and performs at 1. lv214 severity- 2 compatible. the microspace™ is an lv214 s2 qualified crimp- to- wire connector system while microspacexs™ is qualified for both lv214 s2 and uscar- t2v2 specifications. requirement・ ・ ・ record must be maintained. compact, robust and versatile connectors system. furthermore, the pcon12 contact system is released for the application of thick wall, thin wall, ultra- thin wall wires in accordance iso6722, considering that their minimum wire size fulfils the geometrical requirements according to uscar- 21 rev3 and uscar- 2 rev 6, lv112- 1, lv214- 1 and lv214- 3. table elevation monoaxial motion: vertical pdf ( z) lateral ( y) longitudinal ( x) ± 150 mm ± 120 mm ± 140 mm velocity: vertical lateral. this specification is applicable to the termination characteristics of the microspacexstm family of products which provides a unique design enables lv214 ( lv214 pdf severity 2) & uscar ( t2v2) compliant for tin plating. the standard addresses the ability of terminals to be effectively evaluated by crimp force monitors. the standard outlines terminal requirements specifically for the automotive industry. 13 derating with housing acc. microspacexstm will be available in: 1. all tests are per- formed at ambient environmental conditions per din iec 60512 unless otherwise specified. ( z) ( y) longitudinal ( x) 1 m/ s 0, 8 m/ s 0, 8 m/ s. unsealed and sealed. 2 damp heat damp heat 10 days / 40° c / 95% rel. wire- to- board and wire- to- wire configuration. measurement setup in principle like lv214 e14. 2 legend btb: board- to- board. 15, – it goes without saying that every manufacturer wants to ensure they are producing a quality product. humidity insulation resistance at 1kvdc: > 200mω lv214 b 20. updated pg8 test requirements. 14 contact resistance acc. plate size: payload: diameter 2, 2m max. it has many advantages over its uscar certified counterparts. the product design, construction and physical dimensions corresponds to the latest customer drawings.